Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate
2005-09-13
2005-09-13
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
C438S463000, C438S464000
Reexamination Certificate
active
06943094
ABSTRACT:
A method and a system for attaching semiconductor components to a substrate are provided. In the illustrative embodiment the substrate is a leadframe, and the components are semiconductor dice or packages contained on a component substrate such as a wafer. The method includes the steps of holding and dicing the component substrate using a radiation sensitive tape. The method also includes the steps of providing a component attach system having a radiation curing system, and then performing local curing of the dicing tape during a component attach step using the component attach system. The system includes the component attach system which includes a stepper mechanism for stepping the component substrate, and a component attach mechanism having an ejector pin for pushing the components one at a time from the tape and a pick and place mechanism for placing the components on the substrate. The component attach mechanism also includes a housing having a contact surface for physically engaging the dicing tape, and an opening having an outline matching that of a singulated component.
REFERENCES:
patent: 3991296 (1976-11-01), Kojima et al.
patent: 4296542 (1981-10-01), Gotman
patent: 5098501 (1992-03-01), Nishiguchi
patent: 5187007 (1993-02-01), Ebe et al.
patent: 5238876 (1993-08-01), Takeuchi et al.
patent: 5304418 (1994-04-01), Akada et al.
patent: 5310410 (1994-05-01), Begin et al.
patent: 5447266 (1995-09-01), Misono
patent: 5534102 (1996-07-01), Kadono et al.
patent: 5622900 (1997-04-01), Smith
patent: 5670260 (1997-09-01), Zajaczkowski et al.
patent: 5827394 (1998-10-01), Lu
patent: 5851664 (1998-12-01), Bennett et al.
patent: 5888883 (1999-03-01), Sasaki et al.
patent: 5904546 (1999-05-01), Wood et al.
patent: 5952725 (1999-09-01), Ball
patent: 5981391 (1999-11-01), Yamada
patent: 6012502 (2000-01-01), VanNortwick et al.
patent: 6017776 (2000-01-01), Jiang et al.
patent: 6140151 (2000-10-01), Akram
patent: 6184109 (2001-02-01), Sasaki et al.
patent: 6191774 (2001-02-01), Schena et al.
patent: 6200833 (2001-03-01), Jiang et al.
patent: 6201306 (2001-03-01), Kurosawa et al.
patent: 6319754 (2001-11-01), Wang et al.
patent: 6420211 (2002-07-01), Brunet et al.
patent: 6543513 (2003-04-01), Lau et al.
patent: 6589809 (2003-07-01), Koopmans
patent: 6827636 (2004-12-01), Yamada
patent: 2001/0000079 (2001-03-01), Usami et al.
patent: 2002/0066869 (2002-06-01), Nguyen
patent: 2002/0192569 (2002-12-01), Ulland et al.
patent: 2003/0191397 (2003-10-01), Webb
patent: 2003/0201522 (2003-10-01), Usami
Gratton Stephen A.
Micro)n Technology, Inc.
Nguyen Khiem
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