Method for attaching conductive balls to a substrate

Details Method for attaching conductive balls to a substrate Method for attaching conductive balls to a substrate

1992-08-31

1994-02-08

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

427 96, 228254, H01L 2158

Patent

active

052842878

ABSTRACT:
Conductive balls (44), preferably solder balls, are attached to pads (32) on a substrate (30) using a vacuum pick-up tool (34). The pick-up tool lowers the conductive balls into a bath of flux (48) without allowing the balls to touch the bottom of a recess (47) in a flux plate (46), thereby reducing the likelihood of dislodging the solder balls from the pick-up tool. The pick-up tool withdraws the balls from the flux, and aligns the balls with the respective pads on the substrate. Once positioned, the balls are released from the pick-up tool. A reflow operation metallurgically bonds the balls to the pads.

REFERENCES:
patent: 2068250 (1937-01-01), Thomas
patent: 2601307 (1952-06-01), Meyer et al.
patent: 4462534 (1984-07-01), Bitaillov et al.
patent: 4558812 (1985-12-01), Bailey et al.
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5088639 (1992-02-01), Gondotra et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5170931 (1992-12-01), Desai et al.
Research Disclosure Document No. 271009, identified as "Solder Ball Alignment Device by Applying Vacuum to Template Via Plenum," published Nov. 10, 1886. Author not yet known.
Research Disclosure Document No. 316084, identified as "Integrated Surface Mount Module I/O Attachment," published Aug. 10, 1990. Author not yet known.

Affiliated with

Also associated with

Rating

Method for attaching conductive balls to a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for attaching conductive balls to a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for attaching conductive balls to a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-693587