4. Metal fusion bonding
  5. Process
  6. Plural joints

Fonzell D. J. Martin

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Method for attaching conductive balls to a substrate

Metal fusion bonding – Process – Plural joints
Patent

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Self-opening vent hole in an overmolded semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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