Method for attaching a semiconductor die to a substrate and...

Details Method for attaching a semiconductor die to a substrate and... Method for attaching a semiconductor die to a substrate and...

2007-05-22

2007-05-22

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S126000, C438S615000, C257SE21511

Reexamination Certificate

active

10948266

ABSTRACT:
Disclosed are embodiments of a method of attaching a die to a substrate and a heat spreader to the die in a single heating operation. A number of conductive bumps extending from the die may also be reflowed during this heating operation. Other embodiments are described and claimed.

REFERENCES:
patent: 5528462 (1996-06-01), Pendse
patent: 5759269 (1998-06-01), Cutting et al.
patent: 6074897 (2000-06-01), Degani et al.
patent: 6085967 (2000-07-01), Grande et al.
patent: 6161749 (2000-12-01), Bastacky et al.
patent: 6773958 (2004-08-01), Wang
patent: 2003/0047814 (2003-03-01), Kwon
patent: 2003/0089705 (2003-05-01), Shi et al.
patent: 2003/0102016 (2003-06-01), Bouchard
patent: 2005/0224953 (2005-10-01), Lee et al.
patent: 2005/0284863 (2005-12-01), DeBonis
patent: 2006/0040380 (2006-02-01), Besemer et al.

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