Method for attaching a porous metal layer to a metal substrate

Metal fusion bonding – Process – Preplacing solid filler

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S253000, C228S262300, C623S023530, C623S016110

Reexamination Certificate

active

07918382

ABSTRACT:
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.

REFERENCES:
patent: 3353259 (1967-11-01), Kirkpatrick
patent: 3605123 (1971-09-01), Hahn
patent: 3852045 (1974-12-01), Wheeler et al.
patent: 3855638 (1974-12-01), Pilliar
patent: 3906550 (1975-09-01), Rostoker et al.
patent: 4479271 (1984-10-01), Bolesky et al.
patent: 4487808 (1984-12-01), Lambert
patent: 4570271 (1986-02-01), Sump
patent: 4636219 (1987-01-01), Pratt et al.
patent: 4690320 (1987-09-01), Morishita et al.
patent: 4759957 (1988-07-01), Eaton et al.
patent: 4851267 (1989-07-01), Miyauchi et al.
patent: 4854496 (1989-08-01), Bugle
patent: 5013324 (1991-05-01), Zolman et al.
patent: 5027998 (1991-07-01), Bugle
patent: 5104410 (1992-04-01), Chowdhary
patent: 5198308 (1993-03-01), Shetty et al.
patent: 5201766 (1993-04-01), Georgette
patent: 5236457 (1993-08-01), Devanathan
patent: 5282861 (1994-02-01), Kaplan
patent: 5323954 (1994-06-01), Shetty et al.
patent: 5326376 (1994-07-01), Warner et al.
patent: 5342659 (1994-08-01), Horowitz et al.
patent: 5409703 (1995-04-01), McAnalley et al.
patent: 5464440 (1995-11-01), Johansson
patent: 5509899 (1996-04-01), Fan et al.
patent: 5571187 (1996-11-01), Devanathan
patent: 5612052 (1997-03-01), Shalaby
patent: 5714159 (1998-02-01), Shalaby
patent: 6059817 (2000-05-01), Bonutti
patent: 6080488 (2000-06-01), Hostettler et al.
patent: 6100327 (2000-08-01), Scheckenbach
patent: 6110483 (2000-08-01), Whitbourne et al.
patent: 6132674 (2000-10-01), Compton et al.
patent: 6176849 (2001-01-01), Yang et al.
patent: 6203565 (2001-03-01), Bonutti
patent: 6410044 (2002-06-01), Chudzik et al.
patent: 6413539 (2002-07-01), Shalaby
patent: 6527938 (2003-03-01), Bales et al.
patent: 6544472 (2003-04-01), Compton
patent: 6945448 (2005-09-01), Medlin et al.
patent: 7077867 (2006-07-01), Pope et al.
patent: 2003/0036794 (2003-02-01), Ragheb et al.
patent: 2003/0104190 (2003-06-01), Zhou
patent: 2005/0090905 (2005-04-01), Hawkins et al.
patent: 2005/0112397 (2005-05-01), Rolfe et al.
patent: 2005/0184134 (2005-08-01), Charlebois et al.
patent: 2005/0242162 (2005-11-01), Medlin et al.
patent: 2008/0195222 (2008-08-01), Rauguth et al.
patent: 598450 1 (1994-05-01), None
patent: 1433443 (2004-06-01), None
patent: 2142544 (1985-01-01), None
patent: 6-039564 (1994-02-01), None
patent: 11-286704 (1999-10-01), None
Zimmer Technical Memorandum, 1287.02, The Sintering Cycle for the Trabecular Metal Acetabular Cups, May 30, 2002.
U.S. Appl. No. 11/681,268, filed Mar. 2, 2007.
Office Action mailed Feb. 11, 2009 in related Australian Application No. 2003204797.
Response filed Jul. 22, 2009 to the Office Action mailed Feb. 11, 2009 in related Australian Application No. 2003204797.
Office Action mailed May 28, 2004 in related European Application No. 03253855.5.
Response filed Oct. 7, 2004 to the Office Action mailed May 28, 2004 in related European Application No. 03253855.5.
Office Action mailed Nov. 14, 2006 in related European Application No. 03253855.5.
Response filed Apr. 4, 2007 to the Office Action mailed Nov. 14, 2006 in related European Application No. 03253855.5.
Office Action mailed Jul. 8, 2008 in related European Application No. 03253855.5.
Response filed Jan. 9, 2009 to the Office Action mailed Jul. 8, 2008 in related European Application No. 03253855.5.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for attaching a porous metal layer to a metal substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for attaching a porous metal layer to a metal substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for attaching a porous metal layer to a metal substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2635190

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.