Method for assessing workpiece nanotopology using a double...

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Reexamination Certificate

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C451S010000, C451S011000, C451S041000, C451S054000, C451S063000

Reexamination Certificate

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07927185

ABSTRACT:
A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and determining wafer nanotopology using the measured distance. The determining includes using a processor to perform a finite element structural analysis of the wafer based on the measured distance.

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