Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2011-04-19
2011-04-19
Morgan, Eileen P. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S010000, C451S011000, C451S041000, C451S054000, C451S063000
Reexamination Certificate
active
07927185
ABSTRACT:
A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and determining wafer nanotopology using the measured distance. The determining includes using a processor to perform a finite element structural analysis of the wafer based on the measured distance.
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Bhagavat Milind S.
Vandamme Roland R.
Armstrong Teasdale LLP
MEMC Electronic Materials , Inc.
Morgan Eileen P.
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