Method for assembly of printed circuit boards with ultrafine pit

Details Method for assembly of printed circuit boards with ultrafine pit Method for assembly of printed circuit boards with ultrafine pit

1996-01-16

1997-10-21

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

216 20, 216 41, B44C 122

Patent

active

056792662

ABSTRACT:
A method of assembling a printed circuit (PC) boards with ultrafine pitch components. The method comprises: attaching a coarse pitch components on the PC board; applying solvent to the thermal pads of the ultrafine pitch components; mounting a die-attach film on the thermal pads; curing the die-attach film; applying solvent to the die-attach film; forming component leads for the ultrafine pitch components; aligning the ultrafine pitch components to the solder pads; attaching the component leads to the solder pads and the ultrafine pitch components to the thermal pads. Other devices, systems and methods are also disclosed.

REFERENCES:
patent: 5480048 (1996-01-01), Kitamura et al.

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