Method for assaying elements in a substrate for optics,...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S714000, C438S715000, C438S716000, C438S738000, C216S096000, C216S103000, C216S104000, C216S106000, C356S036000

Reexamination Certificate

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10637073

ABSTRACT:
The invention provides a method of assaying at least one element in a material including silicon. The method includes the steps of decomposing a portion of the material with an etching agent to form a solution containing hexafluorosilicic acid and at least one element to be assayed, heating the solution to a temperature sufficient to transform a substantial portion of the hexafluorosilicic acid into silicon tetrafluoride and to cause at least some of the silicon tetrafluoride to evaporate, such that a solution for assaying is obtained in which the silicon content is reduced while and the elements to be assayed are conserved; and assaying at least one element contained in the solution. The invention is applicable to the field of manufacturing substrates or components for optics, electronics, or optoelectronics, and in particular to the field of quality control.

REFERENCES:
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patent: 5552628 (1996-09-01), Watanabe et al.
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patent: 6053984 (2000-04-01), Petvai et al.
patent: 6164133 (2000-12-01), Watanabe
patent: 2002/0101576 (2002-08-01), Shabani et al.
Callister, Materials Science and Engineering, 1997, 4th ed., John Wiley & Sons, pp. 605-607.

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