Method for applying solder to redistribution lines

Details Method for applying solder to redistribution lines Method for applying solder to redistribution lines

2011-03-15

2011-03-15

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S598000, C438S613000, C438S622000

Reexamination Certificate

active

07906421

ABSTRACT:
In a method of making an electronic component, an electrically conductive redistribution line is formed on a surface of a semiconductor chip. The redistribution line includes a solder pad. A covering material is formed over the solder pad and an uncovered portion of the redistribution line is passivated. The covering material prevents passivation of the solder pad. Solder is then formed over the solder pad such that the uncovered portion of the redistribution line has solder resist properties due to the passivating.

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