Method for applying photoresist on wafer

Details Method for applying photoresist on wafer Method for applying photoresist on wafer

1997-01-16

1998-06-30

Bell, Janyce

Coating processes

Centrifugal force utilized

4273855, 437231, B05D 312

Patent

active

057730822

ABSTRACT:
A method for applying photoresist on a wafer is disclosed. The method comprises: lowering the temperature of the photoresist, and dispensing the photoresist on a portion of the wafer, where the wafer is supported by a spinner chuck and is rotated at a low speed. Thereafter, spreading the photoresist on the wafer by rotating the wafer at a high speed. Finally, planarizing the photoresist by rotating the wafer at a medium speed greater than or equal to the low speed in the dispensing step and less than or equal to the high speed in the spreading step.

REFERENCES:
patent: 4741926 (1988-05-01), White et al.

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