Method for applying photoresist

Details Method for applying photoresist Method for applying photoresist

1994-02-28

1996-01-23

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566431, 1566621, 216 41, H01L 2100

Patent

active

054862671

ABSTRACT:
The invention provides a method for substrate preparation prior to applying photoresist to the substrate. A substrate, such as a TEOS-based silicon dioxide or silicon nitride film, is selected and treated with reactive oxygen. The reactive oxygen can comprise ozone or ozone plasma, for example. After treatment of the substrate, the photoresist, preferably an acid-catalyzed photoresist for use with deep UV sensitization, is applied.

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patent: 4877482 (1989-10-01), Knapp et al.
patent: 4902647 (1990-02-01), Chutjian et al.
patent: 5163458 (1992-11-01), Monroe
patent: 5215592 (1993-06-01), Jackson
patent: 5236512 (1993-08-01), Rogers et al.
patent: 5268056 (1993-12-01), Kishi et al.

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