Method for applying adhesives to a lead frame

Details Method for applying adhesives to a lead frame Method for applying adhesives to a lead frame

1997-08-05

2000-01-11

Graybill, David E.

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438111, 438118, 438119, 438123, 438782, H01L 2156, H01L 2160, H01L 2166

Patent

active

060135352

ABSTRACT:
A method for applying a viscous material to a lead frame element. A method of the invention includes positioning the lead frame facing downward and bringing the lead fingers into contact with a pool of adhesive material. The contact of the lead fingers to the adhesive material results in a portion of the lead fingers receiving a portion of the adhesive material from the pool of adhesive material. The gravitational forces on the adhesive material on the downward facing lead frame maintain the shape and boundary definition of the adhesive material.

REFERENCES:
patent: Re35027 (1995-08-01), Ragard
patent: 4346124 (1982-08-01), Wood et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 5139973 (1992-08-01), Nagy et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5322207 (1994-06-01), Fogal et al.
patent: 5409863 (1995-04-01), Newman
patent: 5482736 (1996-01-01), Glenn et al.
patent: 5548160 (1996-08-01), Corbett et al.
patent: 5563443 (1996-10-01), Beng et al.
patent: 5810926 (1998-09-01), Evers

Affiliated with

Also associated with

Rating

Method for applying adhesives to a lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for applying adhesives to a lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for applying adhesives to a lead frame will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1461841