Fishing – trapping – and vermin destroying
Patent
1985-10-30
1987-09-29
Smith, John D.
Fishing, trapping, and vermin destroying
427 99, 427124, 4272551, 4272552, 427253, 118728, H01L 2188
Patent
active
046968334
ABSTRACT:
A method and an apparatus are disclosed which are suitable for applying uniform coatings to integrated circuit (IC) wafers by means of chemical vapor deposition in a process suitable for use in mass production of IC wafers. The process introduces a first group of reactant gases into the vicinity of the wafers through at least one inlet. The number of inlets and the positions of inlets are selected to reduce the total variation in thickness produced on a batch of wafers to within preselected values of variations. The choices of pressure and temperature as well as the choice of gases in the first group are selected to optimize uniformity.
REFERENCES:
patent: 3594227 (1971-07-01), Oswald
patent: 3697343 (1972-10-01), Cuomo et al.
patent: 3704987 (1972-12-01), Arndt et al.
patent: 3717439 (1973-02-01), Sakai
patent: 4096822 (1978-06-01), Yamowaki et al.
patent: 4098923 (1978-07-01), Alberti et al.
patent: 4108106 (1978-08-01), Dozier
patent: 4220116 (1980-09-01), Hochberg
patent: 4309240 (1982-01-01), Zaferes
patent: 4419332 (1983-12-01), von der Ropp
patent: 4466381 (1984-08-01), Jenkins
Monnig Kenneth A.
Quint David W.
Frazzini John A.
Hewlett--Packard Company
Smith John D.
Wong Edward Y.
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