Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1990-12-21
1992-07-28
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430317, 430329, 430330, 427 96, G03F 726
Patent
active
051340569
ABSTRACT:
A solder resist and a positively-acting photoresist are successively applied on a surface-wide basis onto a printed circuit board, whereupon the photoresist is selectively exposed and developed in the region of plated-through holes and/or solder pads of a printed conductor pattern carried on the printed circuit board, preferably with the assistance of laser beams. Subsequently, the solder resist is stripped in the regions not protected by the photoresist, i.e. in the regions of plated-through holes and/or solder pads and, as a last step, the remaining photoresist is likewise stripped. The method is particularly suited for the application of a solder resist layer onto three-dimensional printed circuit boards since traditional mask techniques for structuring the solder resist cannot be employed with respect to three-dimensional printed circuit boards.
REFERENCES:
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patent: 4608274 (1986-08-01), Woofen
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patent: 4966827 (1990-10-01), Sullivan
Hadwiger Helmut
Prochazka Milan
Roelants Eddy
Schmidt Hans-Fr.
Duda Kathleen
McCamish Marion E.
Siemens Aktiengesellschaft
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