Method for application of de-wetting material for glob top appli

Details Method for application of de-wetting material for glob top appli Method for application of de-wetting material for glob top appli

1997-03-24

1999-03-23

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438124, 438126, H01L 2144

Patent

active

058858547

ABSTRACT:
A method of forming high definition elements for electrical and electronic devices, substrates, and other components from or including viscous material. The method includes applying a de-wetting agent to a surface bordering the viscous material prior to applying the viscous material. The de-wetting agent causes the viscous material to "bead-up."

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