Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2011-01-18
2011-01-18
Do, Thuan (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000
Reexamination Certificate
active
07873932
ABSTRACT:
A method for analyzing a component mounting board comprising a step (A) for forming a multilayer substrate shell model of a multilayer wiring board, a step (B) for forming a multilayer component shell model divided by element division lines based on the bonding position of a component to the surface of the multilayer wiring board, step (C) for redividing the mounting position of the component in the multilayer substrate shell model, and step (D) for forming an analysis model by bonding the neutral plane of the substrate and the neutral plane of the component through one of a beam element and a solid element, i.e. a bonding element equivalent to mounting conditions of the component, wherein precision of analysis is enhanced while reducing computation cost by performing calculation while imparting boundary conditions to the analysis model.
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Fujiwara Hiroaki
Iwase Teppei
Kakino Manabu
Kuroishi Tomoaki
Okazaki Toru
Do Thuan
Panasonic Corporation
Steptoe & Johnson LLP
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