Optics: measuring and testing – Inspection of flaws or impurities – Having predetermined light transmission regions
Patent
1997-08-08
1999-02-09
Pham, Hoa Q.
Optics: measuring and testing
Inspection of flaws or impurities
Having predetermined light transmission regions
356398, G01N 2100
Patent
active
058701877
ABSTRACT:
An automated method for aligning wafer surface scan maps and locating defects such as particle contaminant distributions on a wafer surface. More specifically, the invention is an automated method for locating added and removed contaminants and other defects on a semiconductor wafer surface after the wafer has undergone wafer-handling and/or processing. A second data set of a second scan of a wafer surface is misalignment-corrected to a first coordinate system of a first scan of the wafer surface. Thereafter, a final match is made between a first data set of the first scan and the misalignment-corrected data of the second scan. Non-matching locations in the misalignment-corrected data of the second scan represent added defects on the surface of the wafer. Non-matching locations in the base data of the first scan represent removed defects from the surface of the wafer.
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patent: 5497007 (1996-03-01), Uritsky et al.
patent: 5565979 (1996-10-01), Gross
patent: 5640238 (1997-06-01), Nakano et al.
Cai Man-Ping
Kinney Patrick D.
Uritsky Yuri
Applied Materials Inc.
Pham Hoa Q.
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