Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2007-06-26
2007-06-26
Smith, Bradley K (Department: 2891)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C257SE21525, C382S151000
Reexamination Certificate
active
10883711
ABSTRACT:
In a method of aligning a wafer, which is capable of precisely and rapidly aligning the wafer, and a wafer alignment apparatus using the method of aligning the wafer, a first wafer is aligned to form a first template pattern corresponding to an image of the first wafer. Image data of a second wafer is inputted. A kind of the second wafer is different from that of the first wafer. A second template pattern is formed by transforming the first template pattern in response to the image data of the second wafer. The second wafer is then aligned in response to the second template pattern. Accordingly, the template pattern is formed using the image data to align the wafer although wafers having different images are inspected, thereby rapidly forming the template pattern.
REFERENCES:
patent: 6363168 (2002-03-01), Kakuma
patent: 2006/0126916 (2006-06-01), Kokumai
patent: 2002-8028 (2002-01-01), None
patent: 2003-0024363 (2003-03-01), None
Kim Joo-Woo
Lee Byung-Am
Lee Chang-Hoon
Lim Kyu-Hong
Lee & Morse P.C.
Samsung Electronics Co,. Ltd.
Smith Bradley K
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