Method for adjusting the circuit characteristic of a circuit bod

Details Method for adjusting the circuit characteristic of a circuit bod Method for adjusting the circuit characteristic of a circuit bod

1997-10-30

1999-03-09

Bowers, Charles

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438131, 438132, 257 48, H01L 2166

Patent

active

058800166

ABSTRACT:
Adjusting elements (R1, R2 and R3) are redundantly or preliminarily built in an IC circuit body (5), the adjusting elements (R1, R2 and R3) are connected to one another through conductor patterns (P1, P2 and P3) provided outside the circuit body (5), and after the circuit operating function is confirmed by inspection, the conductor patterns (P1, P2 and P3) are selectively cut to select an adjusting element to be used, thereby to adjust or select a function of the circuit body.

REFERENCES:
patent: 4689550 (1987-08-01), Ujihara et al.
patent: 5279984 (1994-01-01), Kinoshita et al.
patent: 5410163 (1995-04-01), Murakami
patent: 5502333 (1996-03-01), Bertin et al.
patent: 5532614 (1996-07-01), Chiu
patent: 5703381 (1997-12-01), Iwasa et al.
patent: 5739718 (1998-04-01), Chevroulet

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