Method for adjusting lithographic mask flatness using...

Photocopying – Projection printing and copying cameras – Detailed holder for original

Reexamination Certificate

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C430S005000

Reexamination Certificate

active

07826038

ABSTRACT:
A method for adjusting the flatness of a lithographic mask includes determining an initial mask flatness of the mask, determining an applied stress for bringing the mask to a desired mask flatness, and determining a mounting temperature of a pellicle frame to be mounted to the mask, the mounting temperature corresponding to the applied stress. The actual temperature of the pellicle frame is adjusted to the determined mounting temperature, and the pellicle frame is mounted to the mask at the mounting temperature.

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E.P. Cotte et al.; “Experimental and Numerical Studies of the Effects of Materials and Attachment Conditions on Pellicle-Induced Distortions in Advanced Photomasks;” Photomask and Next-Generation Lithography Mask Technology IX, Proceedings of SPIE vol. 4754 (2002); pp. 579-588.

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