Method for adhering masking film

Details Method for adhering masking film Method for adhering masking film

1995-05-22

1997-11-18

Mayes, Melvin

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 64, 156250, 156248, B32B 3118

Patent

active

056883544

ABSTRACT:
A masking film adhering method for transporting smoothly and accurately a masking film tape to which a wafer is stuck to the cutting location where the masking film is to be cut. The wafer is stuck onto the masking film tape by passing the masking film tape and the wafer through upper and lower adhesive rollers. The separation of the masking film tape is then increased from a cutting table so that the masking film tape having the wafer stuck thereon may not become adhered to the cutting table, by moving the upper adhesive roller upwardly when the wafer completely passes through the adhesive roller. After the masking film is transported to a cutting location, maintaining a predetermined distance between the masking film and the cutting table, the masking film tape is cut along the shape of the wafer. Sagging of the masking film due to the weight of the wafer is prevented to avoid the masking film tape adhesion to the cutting table. The wafer can be accurately placed onto the cutting location of the masking film tape, to prevent the wafer from being damaged by the cutter.

REFERENCES:
patent: 4436251 (1984-03-01), Deyesso et al.
patent: 4522679 (1985-06-01), Funakoshi et al.
patent: 4680079 (1987-07-01), Tanaka
patent: 4865677 (1989-09-01), Matsushita et al.
patent: 4925515 (1990-05-01), Yoshimura et al.
patent: 5310442 (1994-05-01), Ametani

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