Method for activating fusible links on a circuit substrate

Details Method for activating fusible links on a circuit substrate Method for activating fusible links on a circuit substrate

1998-02-03

2000-05-16

Bowers, Charles

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

Using structure alterable to nonconductive state

438799, H01L 2182

Patent

active

060636513

ABSTRACT:
A method and apparatus for activating fusible links on a circuit substrate. The circuit substrate is supported in a fixture which is cooled to a below ambient temperature. Cooling of the circuit substrate decreases the absorption of energy by the substrate, permitting a smaller spot size laser beam having a lower wavelength to be employed for interrupting the fusible links. The substrate is cooled by a refrigeration coil in heat transfer with the fixture holding the substrate. Moisture formation is avoided by placing the substrate and laser source in a controlled atmosphere.

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