Abrading – Precision device or process - or with condition responsive... – With indicating
Patent
1998-11-03
2000-10-10
Eley, Timothy V.
Abrading
Precision device or process - or with condition responsive...
With indicating
451 21, 451550, B24B 4900
Patent
active
061296090
ABSTRACT:
Material removing machining is for wafer shaped workpieces, in particular semiconductor wafers. There is a method for achieving a wear performance which is as linear as possible for a tool which has an essentially planar working surface for the material removing machining of wafer shaped workpieces. The tool has a wear performance which is as linear as possible. There are also a method and a device for measuring a wear profile on an essentially planar working surface for the material removing machining of wafer shaped workpieces. There is also a carrier which is used for the two-sided material removing machining of wafer shaped workpieces.
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Hofmann Robert
Lehfeld Peter
Lundt Holger
Ripper Bert
Eley Timothy V.
Nguyen Dung Van
Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
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