Method and test structures for measuring interconnect...

Details Method and test structures for measuring interconnect... Method and test structures for measuring interconnect...

2005-03-22

2005-03-22

Zarneke, David (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

06870387

ABSTRACT:
Measurement method and test structures for measuring interconnect coupling capacitance in an IC chip are provided. This method employs CBCM technique. In the first step, two test structures are used to measure a target configuration in order to obtain the total capacitance C of a metal line with respect to ground including line-to-line, fringe and area components (C=2Cc+2Cf+Ca). In the second step, two other test structures are used to measure a dummy configuration in order to obtain the area and fringe capacitance Cdummyof the metal line with respect to ground including fringe and area components (Cdummy=2Cf+Ca). After the two steps, the coupling capacitance Ccbetween the metal line and another line can be determined according to the formula Cc=(C−Cdummy)/2.

REFERENCES:
patent: 5999010 (1999-12-01), Arora et al.
patent: 6404222 (2002-06-01), Fan et al.
patent: 6788074 (2004-09-01), Sarma et al.

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