Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2006-02-28
2006-02-28
Duda, Kathleen (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S394000
Reexamination Certificate
active
07005235
ABSTRACT:
A method for forming an arbitrary pattern of sub-micron contact holes in a substrate using a combination of interferometric photolithography and optical photolithography with a non-critical mask. The substrate is covered with a photosensitive material and is exposed by a standing wave interference pattern produced by the superposition of two coherent laser beams. Then the substrate is rotated through 90° and exposed by the same pattern. The double exposure produces a regular array of sub-micron unexposed regions which are all potentially holes if developed. The photosensitive material is then covered by a non-critical photomask and a standard light source is used to exposed those areas of the photosensitive material containing unwanted holes. Upon final development, the desired pattern is obtained.
REFERENCES:
patent: 4402571 (1983-09-01), Cowan et al.
patent: 4517280 (1985-05-01), Okamoto et al.
patent: 4568631 (1986-02-01), Badami et al.
patent: 5415835 (1995-05-01), Brueck et al.
patent: 5759744 (1998-06-01), Brueck et al.
patent: 5958656 (1999-09-01), Nakao
patent: 6042998 (2000-03-01), Brueck et al.
patent: 6122037 (2000-09-01), Wagner
patent: 6140660 (2000-10-01), Mermelstein
patent: 6233044 (2001-05-01), Brueck et al.
patent: 6709790 (2004-03-01), Gratrix
patent: 2002/0106588 (2002-08-01), Lai et al.
patent: 473814 (1969-06-01), None
Duda Kathleen
Taiwan Semiconductor Manufacturing Co. Ltd.
Thomas Kayden Horstemeyer & Risley
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