Method and system of wire bonding using interposer pads

Details Method and system of wire bonding using interposer pads Method and system of wire bonding using interposer pads

2005-06-21

2005-06-21

Clark, S. V. (Department: 2815)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S784000

Reexamination Certificate

active

06908843

ABSTRACT:
The present invention discloses a method and system of wire bonding a semiconductor die to a lead using interposer pads. The use of disclosed embodiment of the present invention permits combined bonding wire lengths of up to 8 mm while reducing wire sweep, wire spacing violations and wire shorts.

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