Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2008-01-15
2008-01-15
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S014000, C324S765010
Reexamination Certificate
active
07319043
ABSTRACT:
The present invention provides an efficient test method and system for testing the IC package, such as BGA types of packages. With the present invention, manufacturer can have an easier way in testing various types of packages, including newer types. Manufacturer also can get the testing outcome which is more accurate. Furthermore, the present invention helps the manufacturer achieve a significant improvement in an IC packaging process.
REFERENCES:
patent: 5275058 (1994-01-01), Pham et al.
patent: 5533398 (1996-07-01), Sakurai
patent: 5675179 (1997-10-01), Shu et al.
patent: 5686670 (1997-11-01), Vanderlip
patent: 6094144 (2000-07-01), Dishongh et al.
patent: 6133052 (2000-10-01), Ichihara
patent: 6452502 (2002-09-01), Dishongh et al.
patent: 6568581 (2003-05-01), Boller et al.
patent: 6758385 (2004-07-01), Farassat
patent: 6790759 (2004-09-01), Wang et al.
patent: 2005/0225344 (2005-10-01), Kirby
patent: 2006/0103399 (2006-05-01), Kuo
patent: 2006/0194353 (2006-08-01), Spuhler et al.
Tai Cheng Chieh
Yang Wen-Kun
Advanced Chip Engineering Technology Inc.
Kusner & Jaffe
Mandala Jr. Victor A.
Pert Evan
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