Method and system of releasing a MEMS structure

Details Method and system of releasing a MEMS structure Method and system of releasing a MEMS structure

2007-07-31

2007-07-31

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S689000, C438S706000, C438S745000, C257SE21008, C257S499000, C257S503000

Reexamination Certificate

active

11094101

ABSTRACT:
A MEMs (microelectromechanical systems) structure is provided. In one implementation, the MEMs structure includes a substrate wafer including a MEMs device formed on a surface of the substrate wafer, and a MEMs cover structure to cover the MEMs device formed on the surface of the substrate wafer. The MEMs cover structure comprises a first wafer bonded to a second wafer, in which only the first wafer of the MEMs cover structure is sawed through and not the second wafer of the MEMs cover structure during dicing of the MEMs structure.

REFERENCES:
patent: 6232150 (2001-05-01), Lin et al.
patent: 6297072 (2001-10-01), Tilmans et al.
patent: 6624003 (2003-09-01), Rice
patent: 6660564 (2003-12-01), Brady
patent: 6806557 (2004-10-01), Ding
patent: 6822326 (2004-11-01), Enquist et al.
patent: 6939473 (2005-09-01), Nasiri et al.

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