Coating processes – Direct application of electrical – magnetic – wave – or... – Electromagnetic or particulate radiation utilized
Reexamination Certificate
2006-02-07
2006-02-07
Meeks, Timothy (Department: 1762)
Coating processes
Direct application of electrical, magnetic, wave, or...
Electromagnetic or particulate radiation utilized
C427S595000, C427S586000
Reexamination Certificate
active
06994894
ABSTRACT:
A method of depositing a solid film on a substrate in which a stream comprising particles suspended in a transport gas is moved through a heating zone. The particles are combined with the transport gas from a powder feeder operatively coupled to a gas flow tube. The particle stream is directed toward the heating zone by ejecting the powder stream from a nozzle connected to a distal end of the gas flow tube. A radiation source is directed at the suspended particles as they move through the heating zone so that the particles heated to a molten state. The droplets are undercooled in a cooling zone before impact with the substrate.
REFERENCES:
patent: 4947463 (1990-08-01), Matsuda et al.
patent: 4958058 (1990-09-01), Scheidt et al.
patent: 5162969 (1992-11-01), Leung
patent: 5229171 (1993-07-01), Donovan et al.
patent: 5344676 (1994-09-01), Kim et al.
patent: 5718863 (1998-02-01), McHugh et al.
patent: 5847357 (1998-12-01), Woodmansee et al.
patent: 5869432 (1999-02-01), Aksay et al.
patent: 6143378 (2000-11-01), Harwell et al.
patent: 6251488 (2001-06-01), Miller et al.
patent: 6258417 (2001-07-01), Goswami et al.
patent: 6449038 (2002-09-01), Stolze
patent: 2002/0192479 (2002-12-01), Goswami et al.
Bayless Howard H.
Brantley Larry W.
Fuller Eric B.
Meeks Timothy
Vanderbilt University
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