Method and system for spatially selective crystallization of...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S149000, C438S166000, C438S795000

Reexamination Certificate

active

07964453

ABSTRACT:
The manufacturing methodology to produce polycrystalline silicon in time and cost efficient manner uses a spatially selective crystallization approach to greatly reduce the amount of energy delivered to the work surface. The amorphous silicon film is subjected to laser radiation substantially exclusively at localized areas where TFTs are to be formed. The source of radiation is a copper vapor laser which produces a highly stable radiation in a visible spectrum with an energy sufficient to convert amorphous silicon into polysilicon in 1-3 shots. The optic system delivers the homogenized, conditioned and focused laser beam to the area of interest in a controlled manner. Single or multi-laser beam arrangements, as well as different shapes and sizes of laser beam spots are contemplated.

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G. Andra, et al. “Modeling the Preparation of PC-SI Thin Films with a CU Vapor Laser”, Applied Physics, A67, pp. 513-516, 1998.
D. Good, “Novel Processes for Poly-Si Thin-Film Transistors on Plastic Substrates”, Thesis, Electrical Engineering and Computer Sciences. University of California, Berkeley, Spring 2007.

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