Method and system for sealing a substrate

Details Method and system for sealing a substrate Method and system for sealing a substrate

2011-05-03

2011-05-03

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S106000, C438S680000, C257SE21007, C257SE21058, C257SE21170, C257SE21231, C257SE21278, C257SE21329, C257SE21502, C257SE21503, C257SE21128, C257SE29324

Reexamination Certificate

active

07935555

ABSTRACT:
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described. The MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method may include forming a metal seal on the substrate proximate to a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.

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