Method and system for reducing overlay errors within...

Details Method and system for reducing overlay errors within... Method and system for reducing overlay errors within...

2007-08-22

2010-11-30

Young, Christopher G (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

C430S030000

Reexamination Certificate

active

07842442

ABSTRACT:
By taking into consideration tool-specific distortion signatures and reticle-specific placement characteristics in an alignment control system, the control quality of sophisticated APC strategies may be significantly enhanced. Respective correction data may be established on the basis of any combinations of tool/reticles and layers to be aligned to each other, which may modify the respective target values of alignment parameters used for controlling the alignment process on the basis of standard overlay measurement data obtained from dedicated overlay marks.

REFERENCES:
patent: 6924879 (2005-08-01), Ikeda
patent: 7181057 (2007-02-01), Adel et al.
patent: 7295291 (2007-11-01), Smith et al.
patent: 7608468 (2009-10-01), Ghinovker et al.

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