Method and system for reducing overlay errors in...

Details Method and system for reducing overlay errors in... Method and system for reducing overlay errors in...

2009-06-02

2011-10-18

Young, Christopher (Department: 1721)

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

C430S030000, C430S312000, C430S313000, C430S394000

Reexamination Certificate

active

08039181

ABSTRACT:
By taking into consideration the combination of the substrate holders in various lithography tools used during the imaging to two subsequent device layers, enhanced alignment accuracy may be accomplished. Furthermore, restrictive tool dedications for critical lithography processes may be significantly relaxed by providing specific overlay correction data for each possible process flow, wherein, in some illustrative embodiments, a restriction of the number of possible process flows may be accomplished by implementing a rule for selecting a predefined substrate holder when starting the processing of an associated group of substrates.

REFERENCES:
patent: 6841321 (2005-01-01), Matsumoto et al.
patent: 7126669 (2006-10-01), Edart
patent: 7651825 (2010-01-01), Van Bilsen
patent: 7842442 (2010-11-01), Seltmann et al.
patent: 2002/0111038 (2002-08-01), Matsumoto et al.
patent: 2006/0139596 (2006-06-01), Edart
patent: 2006/0210893 (2006-09-01), Van Bilsen
patent: 2008/0057518 (2008-03-01), Tanguay et al.
Translation of Official Communication from German Patent Office for German Patent Application No. 10 2008 035 814.2-51 dated Apr. 22, 2009.

Affiliated with

Also associated with

Rating

Method and system for reducing overlay errors in... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and system for reducing overlay errors in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for reducing overlay errors in... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4299136