Method and system for reducing critical dimension...

Details Method and system for reducing critical dimension... Method and system for reducing critical dimension...

2011-03-29

2011-03-29

Kasenge, Charles R (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C430S030000

Reexamination Certificate

active

07917244

ABSTRACT:
A method for reducing a critical dimension error of a substrate is provided. A first function is identified for correlating a critical dimension error with a first effect. A second function is identified for correlating a critical dimension error with a scan speed. An optimal scan speed for minimizing the critical dimension error is identified by substantially equating the first function and the second function. The substrate may be a mask or a wafer.

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Tichy, Peter, et al., “First Photomask Developer Based on State of the Art Wafer Processing Technology,” Tokyo Electron Limited, TBS Broadcast Center 3-6 Akasaka 5-chome, Minato-ku, Tokyo 107-8481, Japan, Advanced Mask Technology Center, Rahnitzer Allee 9, D-01109 Dresden, Germany, 11 pages, 2004.

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