Electrical computers and digital data processing systems: input/ – Intrasystem connection – Bus expansion or extension
Reexamination Certificate
2005-12-20
2005-12-20
Chang, Daniel (Department: 2819)
Electrical computers and digital data processing systems: input/
Intrasystem connection
Bus expansion or extension
C326S030000, C361S736000, C439S637000
Reexamination Certificate
active
06978333
ABSTRACT:
A method and system are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
REFERENCES:
patent: 5406453 (1995-04-01), Cusato et al.
patent: 5513329 (1996-04-01), Pecone
patent: 5544006 (1996-08-01), Radloff et al.
patent: 5594621 (1997-01-01), van Rumpt
patent: 5604871 (1997-02-01), Pecone
patent: 5655106 (1997-08-01), Smith
patent: 5708563 (1998-01-01), Cranston, III et al.
patent: 5734840 (1998-03-01), Chew et al.
patent: 5765008 (1998-06-01), Desai et al.
patent: 5790814 (1998-08-01), Gan et al.
patent: 5823818 (1998-10-01), Bell et al.
patent: 5831821 (1998-11-01), Scholder et al.
patent: 5878238 (1999-03-01), Gan et al.
patent: 5926378 (1999-07-01), DeWitt et al.
patent: 5991158 (1999-11-01), Chan et al.
patent: 6118668 (2000-09-01), Scholder et al.
patent: 6288898 (2001-09-01), Johnson et al.
patent: 6292361 (2001-09-01), Johnson et al.
patent: 6297957 (2001-10-01), Johnson et al.
patent: 6363450 (2002-03-01), Lash et al.
patent: 6782438 (2004-08-01), Duncan et al.
ATX Riser Card Specification, Version 1.0 Dec. 1999, Intel Corporation.
High-Performance Buses and Interconnects, http://www.extremetech.com.
Brenman, Leor,SmartLink—Using Riser Cards Can Shrink PC Connectivity Costs.
TMC Product Riser Card, http://www.tmc-uk.com.
Bassman Robert
Hayes Stuart
Leins Michael
Timmins Ian
Chang Daniel
Dell Products L.P.
Haynes and Boone LLP
LandOfFree
Method and system for reducing aggregate impedance... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and system for reducing aggregate impedance..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for reducing aggregate impedance... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3503257