Method and system for plasma treatment

Details Method and system for plasma treatment Method and system for plasma treatment

1993-10-25

1995-07-11

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

20429837, 20429838, 118723E, 118723MA, 216 67, H05H 100

Patent

active

054317690

ABSTRACT:
A plasma treatment method and system allowing the plasma intensity to be controllably distributed perpendicularly to the inner wall and ensuring effective and uniform treatment in the case of executing plasma cleaning, plasma CVD, RIE or the like. In the plasma treatment where plasma is generated within a chamber 1 for plasma treatment, magnetic field 31 is applied perpendicularly to the inner wall of the chamber to produce plasma whose intensity is directed perpendicularly to the inner wall of the chamber or in parallel with the surface to be treated. Further, the magnetic filed 31 rendered into a revolving field 32 may be applied to rotate the plasma to accomplish a uniform and effective treatment.

REFERENCES:
patent: 3615956 (1971-10-01), Irving et al.
patent: 4740268 (1988-04-01), Bukhman
patent: 4747368 (1988-05-01), Brien et al.
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patent: 4950956 (1990-08-01), Asamaki et al.
patent: 5000113 (1991-03-01), Wang et al.
patent: 5013401 (1991-05-01), Samukawa et al.
patent: 5038013 (1991-08-01), Akazawa et al.
patent: 5045166 (1991-09-01), Bobbio
patent: 5215619 (1993-06-01), Cheng et al.

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