Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-11-14
2006-11-14
Clark, S. V. (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S614000
Reexamination Certificate
active
07135397
ABSTRACT:
According to one embodiment of the invention, a method of packaging ball grid arrays includes providing a substrate having a plurality of holes formed therein. Each hole is associated with a respective one of a plurality of contact pads formed on a first surface of the substrate. The method further includes disposing a plurality of balls within respective ones of the plurality of holes such that at least a portion of each ball projects outwardly from the first surface, and applying a force to each of the balls from above the first surface to couple the balls to the substrate.
REFERENCES:
patent: 4573105 (1986-02-01), Beldavs
patent: 5164336 (1992-11-01), Ohno et al.
patent: 6180504 (2001-01-01), Farnworth et al.
patent: 6531022 (2003-03-01), Tsukahara
patent: 6595404 (2003-07-01), Suzuki et al.
patent: 6613662 (2003-09-01), Wark et al.
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ASAT Glossary, Page 1 taken from www.ASAT.com website.
“Challenges in High Yield, Fine Pitch Solder Ball Attachment”, by Ivy Qin, et al., SEMI—Semicon Singapore—Semiconductor Packaging Conference, pp. 1-10.
Howard Greg E.
Swanson Leland S.
Brady III Wade James
Clark S. V.
Tung Yingsheng
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