Method and system for monitoring a process of material...

Details Method and system for monitoring a process of material... Method and system for monitoring a process of material...

2005-04-26

2005-04-26

Smith, Zandra (Department: 2877)

Optics: measuring and testing

By dispersed light spectroscopy

Utilizing a spectrophotometer

C356S504000

Reexamination Certificate

active

06885446

ABSTRACT:
A method and system are presented for use in controlling a process of material removal from the surface of a patterned structure, by measuring at least one of residue, erosion, dishing and corrosion effects in the structure induced by this process. The structure is imaged utilizing phase modulation of light reflected from the structure, and a phase map of the structure is thereby obtained. This phase map is analyzed and data indicative of light reflective properties of layer stacks of the structure is utilized to determine a phase difference between light reflected from a selected measured site and at least one reference site spaced-apart from the selected site. The phase difference is thus indicative of the measured effect.

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Ravid et al., “Copper CMP Planarity Control Using ITM”, Sep. 12-14, 2000, 2000 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, pp. 437-443.

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