Method and system for memory thermal load sharing using...

Details Method and system for memory thermal load sharing using... Method and system for memory thermal load sharing using...

2004-10-25

2009-02-24

Nguyen, VanThu (Department: 2824)

Static information storage and retrieval

Read/write circuit

Differential sensing

C365S212000, C326S030000

Reexamination Certificate

active

07495985

ABSTRACT:
Memory component temperature information is used to implement a method for ODT (on die termination) thermal load management. A respective temperature of a plurality of memory components are accessed, and based on this temperature, an ODT cycle is directed to a first of the memory components to avoid imposing a thermal load from the ODT cycle on a second of the memory components.

REFERENCES:
patent: 5237460 (1993-08-01), Miller et al.
patent: 6523102 (2003-02-01), Dye et al.
patent: 6545684 (2003-04-01), Dragony et al.
patent: 6704022 (2004-03-01), Aleksic
patent: 6772352 (2004-08-01), Williams et al.
patent: 6832177 (2004-12-01), Khandekar et al.
patent: 6980020 (2005-12-01), Best et al.
patent: 7034565 (2006-04-01), Lee
patent: 7061640 (2006-06-01), Maeda
Johnson, Chris, “Graphics DDR3 On-Die Termination and Thermal Considerations.” Micron Designline, vol. 12, Issue 1. Rev. Apr. 1, 2003. 8 pgs.

Affiliated with

Also associated with

Rating

Method and system for memory thermal load sharing using... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and system for memory thermal load sharing using..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for memory thermal load sharing using... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4113614