Method and system for integrated circuit packaging

Details Method and system for integrated circuit packaging Method and system for integrated circuit packaging

2005-11-29

2005-11-29

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S112000, C438S124000, C438S126000

Reexamination Certificate

active

06969641

ABSTRACT:
According to one embodiment of the invention, a method of packaging integrated circuits includes disposing an integrated circuit chip outwardly from a first surface of a substrate, positioning the integrated circuit chip and the substrate between a first mold press die and a second mold press die, and engaging the first mold press die with the second mold press die such that the integrated circuit chip is disposed within a cavity formed by the engagement of the first mold press die with the second mold press die. The cavity includes a pre-warped configuration. The method further includes encapsulating the integrated circuit chip with a mold compound such that the mold compound takes on the pre-warped configuration of the cavity, removing the encapsulated integrated circuit chip from the cavity, and curing the mold compound. The curing transforms the mold compound from the pre-warped configuration to a predefined configuration.

REFERENCES:
patent: 6224936 (2001-05-01), Gochnour et al.
patent: 6432750 (2002-08-01), Jeon et al.
patent: 2001/0045643 (2001-11-01), Katoh et al.

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