Etching a substrate: processes – Gas phase etching of substrate – With measuring – testing – or inspecting
Reexamination Certificate
2006-11-14
2006-11-14
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Gas phase etching of substrate
With measuring, testing, or inspecting
C216S060000, C216S063000, C216S066000, C250S492300, C438S014000, C438S016000, C438S017000, C204S192330, C700S121000
Reexamination Certificate
active
07135123
ABSTRACT:
The backside navigation method of the present invention includes milling a fiducial opening through the substrate of an integrated circuit. The milling process is stopped when the fiducial opening reaches the bottom of a trench isolation structure. The trench isolation structure delineated by the fiducial opening may be imaged and registered to a computer aided design layout image to achieve sub-micron navigation resolution.
REFERENCES:
patent: 5948217 (1999-09-01), Winer et al.
patent: 6518571 (2003-02-01), Talbot et al.
patent: 6855622 (2005-02-01), Le Roy et al.
patent: 6958248 (2005-10-01), Roy et al.
Kardach Catherine
Le Roy Erwan
Lundquist Theodore
Thompson Mark Alan
Thompson William B.
Ahmed Shamim
Credence Systems Corporation
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