Method and system for integrated circuit backside navigation

Etching a substrate: processes – Gas phase etching of substrate – With measuring – testing – or inspecting

Reexamination Certificate

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Details

C216S060000, C216S063000, C216S066000, C250S492300, C438S014000, C438S016000, C438S017000, C204S192330, C700S121000

Reexamination Certificate

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07135123

ABSTRACT:
The backside navigation method of the present invention includes milling a fiducial opening through the substrate of an integrated circuit. The milling process is stopped when the fiducial opening reaches the bottom of a trench isolation structure. The trench isolation structure delineated by the fiducial opening may be imaged and registered to a computer aided design layout image to achieve sub-micron navigation resolution.

REFERENCES:
patent: 5948217 (1999-09-01), Winer et al.
patent: 6518571 (2003-02-01), Talbot et al.
patent: 6855622 (2005-02-01), Le Roy et al.
patent: 6958248 (2005-10-01), Roy et al.

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