Method and system for improving wet chemical bath process...

Details Method and system for improving wet chemical bath process... Method and system for improving wet chemical bath process...

2011-03-22

2011-03-22

Culbert, Roberts (Department: 1716)

Etching a substrate: processes

Nongaseous phase etching of substrate

With measuring, testing, or inspecting

C438S710000, C438S756000, C216S099000

Reexamination Certificate

active

07910014

ABSTRACT:
A chemical processing bath and system used in semiconductor manufacturing utilizes a dynamic spiking model that essentially constantly monitors chemical concentration in the processing bath and adds fresh chemical on a regular basis to maintain chemical concentrations at desirable levels. Etch rates and etch selectivities are maintained at desirable levels and contamination from undesirable precipitation is avoided. The system and method automatically compare concentration levels to a plurality of control limits associated with various technologies and identify the technology or technologies that may undergo processing.

REFERENCES:
patent: 6207068 (2001-03-01), Glick et al.
patent: 6399517 (2002-06-01), Yokomizo et al.
patent: 6699400 (2004-03-01), Ballantine et al.
patent: 2002/0173154 (2002-11-01), Tucker et al.
Zin-Chang Wei et al., Apparatus and Method for Controlling Silicon Nitride Etching Tank, U.S. Appl. No. 11/627,030, filed Jan. 25, 2007.

Affiliated with

Also associated with

Rating

Method and system for improving wet chemical bath process... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and system for improving wet chemical bath process..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for improving wet chemical bath process... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2668547