Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-12-04
2007-12-04
Crispino, Richard (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S300000
Reexamination Certificate
active
10693323
ABSTRACT:
A method for hermetically sealing devices. The method includes providing a substrate which includes a plurality of individual chips. Each of the chips includes a plurality of devices and each of the chips are arranged in a spatial manner as a first array. The method also provides a transparent member of a predetermined thickness which includes a plurality of recessed regions arranged in a spatial manner as a second array and a standoff region. The method also includes aligning the transparent member in a manner to couple each of the plurality of recessed regions to a respective one of said plurality of chips. The method further includes hermetically sealing each of the chips within one of the respective recessed regions by using at least a bonding process to isolate each of the chips within one of the recessed regions.
REFERENCES:
patent: 3997964 (1976-12-01), Holbrook et al.
patent: 5457022 (1995-10-01), Hioki et al.
patent: 6093623 (2000-07-01), Forbes
patent: 6294439 (2001-09-01), Sasaki et al.
patent: 6396711 (2002-05-01), Degani et al.
patent: 6562658 (2003-05-01), Ohuchi et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6653210 (2003-11-01), Choo et al.
patent: 6664503 (2003-12-01), Hsieh et al.
patent: 6822326 (2004-11-01), Enquist et al.
patent: 2001/0022382 (2001-09-01), Shook
patent: 2002/0181838 (2002-12-01), Cunningham et al.
patent: 2003/0025984 (2003-02-01), Gudeman et al.
patent: 2004/0087053 (2004-05-01), Lytle et al.
patent: 2004/0219764 (2004-11-01), Syllaios et al.
patent: 2005/0233546 (2005-10-01), Oohata et al.
patent: WO 01/29890 (2001-04-01), None
patent: 03/054927 (2003-07-01), None
patent: 2004/099065 (2004-11-01), None
Chen Dongmin
Yang Xiao
Crispino Richard
Miradia Inc.
Schatz Chris T.
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