Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Magnetic field
Reexamination Certificate
2010-05-10
2011-12-06
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Magnetic field
C365S051000, C365S097000, C365S157000, C365S158000, C365S189011
Reexamination Certificate
active
08072037
ABSTRACT:
A chip and a chip package can transmit information to each other by using a set of converters capable of communicating with each other through the emission and reception of electromagnetic signals. Both the chip and the chip package have at least one such converter physically disposed on them. Each converter is able to (1) convert received electromagnetic signals into electronic signals, which it then may relay to leads on the device on which it is disposed; and (2) receive electronic signals from leads on the device on which it is disposed and convert them into corresponding electromagnetic signals, which it may transmit to a corresponding converter on the other device. Not having a direct physical connection between the chip and the chip package decreases the inductive and capacitive effects commonly experienced with physical bonds.
REFERENCES:
patent: 4199777 (1980-04-01), Maruyama et al.
patent: 4268843 (1981-05-01), Brown et al.
patent: 4758062 (1988-07-01), Sunagawa et al.
patent: 5047835 (1991-09-01), Chang
patent: 5051790 (1991-09-01), Hammer
patent: 5198684 (1993-03-01), Sudo
patent: 5200631 (1993-04-01), Austin et al.
patent: 5237441 (1993-08-01), Nhu
patent: 5335361 (1994-08-01), Ghaem
patent: 5424573 (1995-06-01), Kato et al.
patent: 5638469 (1997-06-01), Feldman et al.
patent: 6049639 (2000-04-01), Paniccia et al.
patent: 6093938 (2000-07-01), Minemier et al.
patent: 6215577 (2001-04-01), Koehl et al.
patent: 6229158 (2001-05-01), Minemier et al.
patent: 6477285 (2002-11-01), Shanley
patent: 6477286 (2002-11-01), Ouchi
patent: 6586726 (2003-07-01), Verdiell
patent: 6617181 (2003-09-01), Wright et al.
patent: 6815621 (2004-11-01), Park et al.
patent: 6822267 (2004-11-01), Okayasu
patent: 6831301 (2004-12-01), Murphy et al.
patent: 6842347 (2005-01-01), Chang
patent: 6936489 (2005-08-01), Murphy et al.
patent: 7015559 (2006-03-01), Murphy et al.
patent: 7335985 (2008-02-01), Murphy et al.
patent: 7732882 (2010-06-01), Murphy et al.
Sclater, Neil, “Random-Access Memories (RAMs),” Electronics Technology Handbook, New York: McGraw-Hill, pp. 178-181, 1999.
Gotcher Lee
Murphy Tim
Clark Jasmine
Dorsey & Whitney LLP
Micro)n Technology, Inc.
LandOfFree
Method and system for electrically coupling a chip to chip... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and system for electrically coupling a chip to chip..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for electrically coupling a chip to chip... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4313704