Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2006-07-11
2006-07-11
Von Buhr, Maria N. (Department: 2125)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S074000
Reexamination Certificate
active
07076321
ABSTRACT:
The present invention is generally directed to various methods and systems for dynamically adjusting metrology sampling based upon available metrology capacity. In one illustrative embodiment, the method comprises providing a metrology control unit that is adapted to determine a baseline metrology sampling rate for at least one metrology operation, determining available metrology capacity, and providing the determined available metrology capacity to the metrology control unit wherein the metrology control unit determines a new metrology sampling rate based upon the determined available metrology capacity.
REFERENCES:
patent: 5402367 (1995-03-01), Sullivan et al.
patent: 5586039 (1996-12-01), Hirsch et al.
patent: 5620556 (1997-04-01), Henck
patent: 5657252 (1997-08-01), George
patent: 5661669 (1997-08-01), Mozumder et al.
patent: 5770098 (1998-06-01), Araki et al.
patent: 5822218 (1998-10-01), Moosa et al.
patent: 5896294 (1999-04-01), Chow et al.
patent: 5982920 (1999-11-01), Tobin, Jr. et al.
patent: 5999003 (1999-12-01), Steffan et al.
patent: 6002989 (1999-12-01), Shiba et al.
patent: 6136712 (2000-10-01), Klippert, II et al.
patent: 6166801 (2000-12-01), Dishon et al.
patent: 6245581 (2001-06-01), Bonser et al.
patent: 6248602 (2001-06-01), Bode et al.
patent: 6263255 (2001-07-01), Tan et al.
patent: 6281962 (2001-08-01), Ogata et al.
patent: 6303395 (2001-10-01), Nulman
patent: 6337217 (2002-01-01), Hause et al.
patent: 6374199 (2002-04-01), Sugimoto
patent: 6403385 (2002-06-01), Venkatkrishnan
patent: 6408219 (2002-06-01), Lamey, Jr. et al.
patent: 6421574 (2002-07-01), Steffan et al.
patent: 6442496 (2002-08-01), Pasadyn et al.
patent: 6461878 (2002-10-01), Lansford
patent: 6469518 (2002-10-01), Davis et al.
patent: 6477432 (2002-11-01), Chen et al.
patent: 6526547 (2003-02-01), Breiner et al.
patent: 6577972 (2003-06-01), Yanaru et al.
patent: 6650955 (2003-11-01), Sonderman et al.
patent: 6687561 (2004-02-01), Pasadyn et al.
patent: 6766214 (2004-07-01), Wang et al.
patent: 6821792 (2004-11-01), Sonderman et al.
patent: 6831555 (2004-12-01), Miller et al.
patent: 6859746 (2005-02-01), Stirton
patent: 6868299 (2005-03-01), Chandra et al.
patent: 2002/0193899 (2002-12-01), Shanmugasundram et al.
patent: 2003/0204348 (2003-10-01), Suzuki et al.
patent: 2004/0121495 (2004-06-01), Sonderman et al.
patent: WO 02/23289 (2002-03-01), None
patent: WO 02/103778 (2002-12-01), None
patent: WO 2004/061938 (2004-07-01), None
Williams et al., “Optimized Sample Planning for Wafer Defect Inspection,” 1999 IEEE.
McIntyre et al., “Key Considerations in the Development of Defect Sampling Methodologies,” 1996 IEEE.
Advanced Micro Devices , Inc.
Von Buhr Maria N.
Williams Morgan & Amerson P.C.
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