Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2007-02-01
2010-06-22
Aftergut, Jeff H (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S273500, C156S273700
Reexamination Certificate
active
07740729
ABSTRACT:
Techniques for bonding two disks with a minimized eccentricity (ECC) are disclosed. A positioning header includes an ECC controlling structure that further includes a positioning header. In one embodiment, the position header includes three members that form a round stand with a diameter smaller than the inner diameter of the disks. The round stand expands to the inner diameter of the disks to close the gap as a result of the difference between the two diameters when the three members are caused to expand. In one embodiment, the movement of the three members is controlled by magnetic means. Depending on the positions of the ECC controlling structure, the three members are expanded from or restored to their default positions.
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Fan Kai Leung
Li Ming
Mu Congyi
Wu Hong
Yeung Ming Sang
Aftergut Jeff H
Anwell Precision Technology (HK) Limited
Dongguan Anwell Digital Machinery Co., Ltd.
Wuxi Sino IP Agency, Ltd.
Zheng Joe
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