Method and system for chemical mechanical polishing of semicondu

Details Method and system for chemical mechanical polishing of semicondu Method and system for chemical mechanical polishing of semicondu

1994-08-31

1997-01-28

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 2, 134 33, B24B 3700, H01L 2100

Patent

active

055974430

ABSTRACT:
A method and system (10) for chemical mechanical polishing (CMP) semiconductor wafer (14) coats (22) semiconductor wafer (14) with a slurry having an predetermined pH value. Semiconductor wafer (14) is then polished with polishing pad (19). Then, CMP system (10) sprays semiconductor wafer (14) with an aqueous solution (30) and a pH controlling compound (34) for controlling the predetermined pH of the slurry and removing the slurry from the semiconductor wafer (14). The effect is minimize the number of particles remaining on semiconductor wafer (14) following the CMP process.

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