Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2006-03-14
2006-03-14
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C257S048000
Reexamination Certificate
active
07011980
ABSTRACT:
A structure and method for measuring leakage current. The structure includes: a body formed in a semiconductor substrate; a dielectric layer on a top surface of the silicon body; and a conductive layer on a top surface of the dielectric layer, a first region of the dielectric layer having a first thickness and a second region of the dielectric layer between the conductive layer and the top surface of the body having a second thickness, the second thickness different from the first thickness. The method includes, providing two of the above structures having different areas of first and the same area of second or having different areas of second and the same area of first dielectric regions, measuring a current between the conductive layer and the body for each structure and calculating a gate tunneling leakage current based on the current measurements and dielectric layer areas of the two devices.
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Na Myung-Hee
Nowak Edward J.
Canale Anthony J.
International Business Machines - Corporation
Lebentritt Michael
Schmeiser Olsen & Watts
Stevenson Andre′ C.
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