Method and structures for indexing dice

Details Method and structures for indexing dice Method and structures for indexing dice

2008-02-19

2009-02-17

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

Reexamination Certificate

active

07491620

ABSTRACT:
A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.

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European Search Report for EP 04 10 1599 dated Sep. 7, 2004.

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