Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature
Reexamination Certificate
2008-02-19
2009-02-17
Potter, Roy K (Department: 2822)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Having substrate registration feature
Reexamination Certificate
active
07491620
ABSTRACT:
A method of indexing a plurality of dice obtained from a material wafer comprising a plurality of stacked material layers, each die being obtained in a respective die position in the wafer, the method including providing a visible index on each die indicative of the respective die position, wherein providing the visible index on each die includes: forming in a first material layer of the die a reference structure adapted to defining a mapping of the wafer; and forming in a second material layer of the die a marker associated with the reference structure, a position of the marker with respect to the reference structure being adapted to provide an indication of the die position in the wafer.
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European Search Report for EP 04 10 1599 dated Sep. 7, 2004.
Brambilla Daniele Alfredo
Valtolina Marco Natale
Graybeal Jackson LLP
Jorgenson Lisa K.
Potter Roy K
Santarelli Bryan A.
STMicroelectronics S.r.l.
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