Abrading – Machine – Rotary tool
Reexamination Certificate
2007-12-06
2009-12-15
Morgan, Eileen P. (Department: 3723)
Abrading
Machine
Rotary tool
C451S288000, C451S388000, C451S398000
Reexamination Certificate
active
07632173
ABSTRACT:
The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
REFERENCES:
patent: 6210255 (2001-04-01), Zuniga et al.
patent: 6390904 (2002-05-01), Gleason et al.
patent: 6422927 (2002-07-01), Zuniga
patent: 6790763 (2004-09-01), Kondo et al.
patent: 6852019 (2005-02-01), Togawa et al.
patent: 7033260 (2006-04-01), Togawa et al.
patent: 2002/0098780 (2002-07-01), Boo et al.
patent: 1066925 (2001-01-01), None
patent: 8-229804 (1996-09-01), None
patent: 2000-301453 (2000-10-01), None
patent: 2001-60572 (2001-03-01), None
patent: 2001-260004 (2001-09-01), None
patent: 2002-187060 (2002-07-01), None
patent: 2002-198337 (2002-07-01), None
patent: 00/30807 (2000-06-01), None
Fukushima Makoto
Ichimura Teruhiko
Nabeya Osamu
Sakurai Kunihiko
Togawa Tetsuji
Ebara Corporation
Morgan Eileen P.
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Substrate holding apparatus and polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate holding apparatus and polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate holding apparatus and polishing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4122690